发明名称 CURABLE COMPOSITION AND SEALING METHOD
摘要 An object of the present invention is to provide a curable composition excellent in on-site formability, excellent in heat resistance, chemical resistance and oil resistance, and low in compression set. The invention relates to a curable composition comprising (a) a vinyl-based polymer containing at least one (meth)acryloyl group in a molecule thereof and having a number average molecular weight of 500 to 1,000,000, (b) an ethylenic unsaturated group-containing compound, (c) a thixotropic property-imparting agent, (d) fumed silica surface-treated with a (meth)acryloyl group-containing silane and (e) a photopolymerization initiator.
申请公布号 US2009025870(A1) 申请公布日期 2009.01.29
申请号 US20060994169 申请日期 2006.06.30
申请人 THREE BOND CO., LTD. 发明人 TANAKA MASAYUKI
分类号 B29C65/48;C08J3/28 主分类号 B29C65/48
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