发明名称 MOLD FOR INJECTION MOLDING AND METHOD OF INJECTION MOLDING
摘要 As a mold for the injection molding and injection molding method, the temperature of the mold can be rapidly increased through the microwave induction heating. The high luster injection molded part without the surface defect like the weld line can be manufactured. A mold for the injection molding comprises a first mold(20) having the cavity(21) in which solution is injected; and a second mold(30) combined in the first mold in order to shut cavity tightly. In one among the first and the second mold, first mold and the second mold, a microwave induction heating(32) for heating up the corresponding mold is inserted.
申请公布号 KR20090010438(A) 申请公布日期 2009.01.30
申请号 KR20070073540 申请日期 2007.07.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 IWATA TAKAO;LEE, DONG HEE;JUNG, DONG SOO
分类号 B29C45/26;B29C45/73 主分类号 B29C45/26
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