| 摘要 |
PURPOSE:To efficiently use the wire solder on purpose to reduce the manufacturing cost for the ring type solder, by bending the wire solder of specified length into a circular type, and by executing the compression forming into specified diameter and thickness. CONSTITUTION:A required amount of the wire solder 6 is fed while being pinched and collapsed by the drive roller 7 and the idle roller 8; at the same time, the cutting and bending parts 9 is moved down. The wire solder 6 is cut and bent into a horseshoe type between the semicircular concave 9b and the core metal. The left side bending parts 10 and the right side bending parts 11 are moved so as to form the horseshoe type wire solder into a ring type. The bending parts 10, 11, are moved back and the punch 13 is moved on purpose to execute the compression forming on the wire solder, which is bent into a ring type within the space being settled by the through hole 15a of the dies 15 and the end face 14a of the knockout sleeve 14; hereby, the junction is smoothed. According to this method, the easily handleable ring type solder without burr and edge can be obtained. |
