Method for producing conductive tracks over trench regions of integrated semiconductor circuits, positive photoresist being used for the structuring

摘要

The invention relates to a method, by means of which for the conductive and structured connection, in a plane, of components which have a level difference of up to 50 mu m, resist structures for producing these conductive tracks in the micrometer range are produced on substrates by means of photolithography. This method is used in the production of micromechanical sensors and actuators in the technical process of semiconductor technology.