发明名称 Electroplating method and apparatus.
摘要 <p>A method of removing metal from a feedstock solution containing dissolved metal ions which comprises passing the feedstock through an annular gap, the inner surface of which is cathodic to the metal ion and the outer surface of which is anodic in such a way that the flow is turbulent. Also claimed is an apparatus for removing metal from a feedstock which comprises a reactor afforded by an inner cathode tube, and an outer anode tube spaced therefrom by a narrow annular gap, direct electric current supply means to the anode and cathode, pump means for pumping feedstock into the said annular gap at high flow rates, a holding tank, pipe work connecting the holding tank to the said pump means and pipe work connecting the end of the annular gap remote from the pump to the holding tank. &lt;IMAGE&gt;</p>
申请公布号 EP0627502(A2) 申请公布日期 1994.12.07
申请号 EP19940303865 申请日期 1994.05.27
申请人 ENTHONE-OMI, INC. 发明人 SCHWALB, ADRIAN;HEMSLEY, JOHN DAVID CROWTHER;GALE, ALBERT WILLIAM
分类号 C25C1/00;C25C7/00;C25C7/06;C25C7/08;(IPC1-7):C25C1/00 主分类号 C25C1/00
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