| 摘要 |
the invention relates to the use of copolyamides as hot-melt adhesives for heat-sealing, where at least 3 monomer components selected from the following group are copolymerised in the copolyamide: an equimolar mixture of adipic acid and hexamethylenediamine (6,6-salt), laurolactam, 11-aminoundecanoic acid, an equimolar mixture of azelaic acid and hexamethylenediamine (6,9-salt), an equimolar mixture of sebacic acid and hexamethylenediamine (6,10-salt) and an equimolar mixture of dodecanedioic acid and hexamethylenediamine (6,12-salt), where the melting point of the copolyamide is below 140@C, and at least 10 % by weight of laurolactam and/or 11-aminoundecanoic acid are copolymerised. |
