发明名称 MOISTURE-CURABLE HOT MELT ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a moisture-curable hot melt adhesive long in open time, having high initial adhesive strength and further excellent in detachability from aluminium pack.SOLUTION: The moisture-curable hot melt adhesive of the present invention which is a reaction product between a polyisocyanate compound and a raw material containing 20 to 30 mass% of crystalline polyester polyol which is a condensed polymer of linear polycarbonic acid having 6 to 12 carbon atoms and linear polyol having 2 to 6 carbon atoms, 35 to 45 mass% of polyether polyol having number average molecular weight of 400 to 10000, 25 to 35 mass% of an acrylic copolymer having number average molecular weight of 30000 or more and glass transition temperature of 40 to 90°C and 3 to 7 mass% of a higher alcohol having 18 or more carbon atoms and contains an urethane polymer containing an isocyanate group at a terminal.SELECTED DRAWING: Figure 1
申请公布号 JP2016088948(A) 申请公布日期 2016.05.23
申请号 JP20140220870 申请日期 2014.10.29
申请人 SEKISUI FULLER CO LTD 发明人 KIMURA OSAMU
分类号 C09J175/04;C09J5/06;C09J175/06;C09J175/08 主分类号 C09J175/04
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