| 摘要 |
PURPOSE:To provide a resin sealing mold wherein no resin burr is left, and a gate can be easily broken off. CONSTITUTION:A resin sealing mold 1 is composed of a cope 2 where an upper cavity 21 is provided and a drag 3 wherein a lower cavity 31 is provided, wherein the upper and lower cavity, 21 and 31, form a cavity chamber in which a semiconductor element mounted nearly on the center of a lead frame 11 is placed. A runner 22 is so provided to the mold 1 as to introduce sealing resin 7 into the cavity chamber from the outside of the lead frame 11, and a core 4 which presses the periphery of the lead frame 11 is provided between the drag 3 and the cope 2 except the cavity chamber, and the runner 22 is provided along the surface on the side of the core 4 which is not brought into contact with the lead frame 11. |
