发明名称 MOLD APPARATUS
摘要 PURPOSE:To provide a mold apparatus by which burrs on the peripheral part of a pot of a mold for molding a thermosetting resin can be reduced. CONSTITUTION:The apparatus consists of a pot 1 into which a thermosetting resin is poured, a plunger 2 for pushing out the thermosetting resin poured into the pot 1, a pot holder 3a and a sub pot holder 3b holding the pot 1, a cull block 4 which is a part of a mold for molding the thermosetting resin, and an elastic means imparting the elasticity to the pot 1. In addition, the elastic means is constituted of an elastic pin 5 and an elastic pin holder 6 and a structure wherein the pot end face 1c of the pot is projected more than the pot holder end face 3c of the pot holder 3a is provided by the elastic means.
申请公布号 JPH06335937(A) 申请公布日期 1994.12.06
申请号 JP19930127331 申请日期 1993.05.28
申请人 HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD 发明人 SUZUKI JUNICHI
分类号 B29C45/02;B29C45/26;B29K101/10;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/02
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