Semiconductor device and method of assembling the same

摘要

In a semiconductor device, a semiconductor element is stored in a casing while being held by external electrodes through first and second electrodes. The outer peripheral edge of the first electrode plate is projected outwardly beyond that of the semiconductor element and a ring-shaped groove is provided in the first surface of the first electrode plate along the outer peripheral edge of the semiconductor element. An adhesive holding member is charged in the groove and the outer peripheral portion of the semiconductor element. Thus, the semiconductor element is fixed to the first electrode plate and is protected by the adhesive holding member covering its end portion.