Semiconductor package device and forming the same

摘要

In some embodiments in accordance with the present disclosure, a semiconductor device having a semiconductor substrate is provided. A metal structure is disposed over the semiconductor substrate, and a post-passivation interconnect (PPI) is disposed over the metal structure. In addition, the upper surface of the PPI is configured to receive a bump thereon. In certain embodiments, the upper surface of the PPI for receiving the bump is substantially flat. A positioning member is formed over the PPI and configured to accommodate the bump. In some embodiments, the positioning member is configured to limit bump movement after the bump is disposed over the PPI so as to retain the bump at a predetermined position.

主权项

1. A semiconductor device, comprising:
a semiconductor substrate; a metal structure over the semiconductor substrate; a post-passivation interconnect (PPI) over the metal structure and configured to receive a bump; and a positioning member over the PPI, having a partial circular shape and configured to accommodate the bump.