WAFER SUPPORTING MECHANISM FOR SEMICONDUCTOR MANUFACTURING DEVICE

摘要

PURPOSE:To prevent a wafer from warping due to thermal stress dislocation due to a wafer supporting mechanism for a semiconductor manufacturing device. CONSTITUTION:Two pairs of vertical supporting columns 11A-11D for a wafer boat are formed on a plurality of arc-shaped horizontal shelves. The wafer supporting areas 16a and 16b of one pair of the supporting columns 11A and 11B on the front side of a wafer are permitted to be larger than the wafer supporting areas 16c and 16d of the shelf of one pair of the supporting columns 11C and 1D on the rear side, and the front side edge positions of one pair of the supporting columns 11A and 11B on the front side are arranged on a vertical plane which is rotated to the front side at 90 deg. from the vertical center plane of the supporting column 11C and 11D at the rear with the center line of the wafer boat as the center. As for the material of the supporting columns 11A-11D, SiC is used and the surface of the material is preferably coated with CVD coating.