| 摘要 |
An adhesive arrangement (100) includes an adhesive formed from an adhesive composition (101) having a thermoplastic material and a melt-processable perfluoropolymeric material. The adhesive arrangement further includes a base layer (103) in contact with the adhesive. The thermoplastic material is polyetherimide (PEI), polypheny lenesulfide (PPS), polyaryletherketone (PAEK) including poly etheretherke tone (PEEK), polyamide (PA), and/or polysulfone derivatives including polysulfone. The base layer is a perfluoropolymeric material, a composite material, a metal material, a metallic material, another suitable material, or a combination thereof. |
