发明名称 STRUCTURE OF FRONT SURFACE PLATE OF ELECTRONIC CIRCUIT PACKAGE
摘要 PURPOSE:To provide the structure of the front surface plate of an electronic circuit package with which inevitable troubles, such as failure of optical cables, as experienced heretofore are rationally averted and solved and the future miniaturization, etc., of the device are rationally realizable. CONSTITUTION:An optical connector 67 for optical connection is mounted on the front surface plate 11 of the electronic circuit package 5 which can be freely attachably and detachably packaged in an electronic device housing section 1 with a prescribed angle of inclination in such a manner that the folded and bent cable part of the optical cable 65 has a substantially large curvature in the optically connected state of the corresponding optical connector 69 of the optical cable 65 to the optical connector 67.
申请公布号 JPH06337317(A) 申请公布日期 1994.12.06
申请号 JP19930125772 申请日期 1993.05.27
申请人 FUJITSU LTD 发明人 SUNADA TSUNEMI
分类号 G02B6/00 主分类号 G02B6/00
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