| 摘要 |
PURPOSE:To provide an etching method wherein a stainless steel board is not eroded and a copper circuit of high precision is formed. CONSTITUTION:A circuit pattern is formed on a copper film arranged on an insulating film covering a stainless steel board, by using resist ink. Aqueous solution of nitrate of metal whose ionization tendency is larger than copper is brought into contact with the stainless steel board, and only the copper film which is not covered with the resist is dissolved and eliminated. Thus the etching method of the copper film arranged on the insulating film covering the stainless steel board is obtained. |
