发明名称 PRODUCTION OF METAL FOIL CLAD LAMINATED SHEET AND METAL FOIL USED THEREIN
摘要 <p>PURPOSE:To ensure the reduction of the elasticity of a surface layer necessary for ensuring, the solder connection reliability of SMD and the peeling strength and heat resistance of a metal foil as a metal foil clad laminated sheet suitable for the substrate of an SMD corresponding printed wiring board. CONSTITUTION:An adhesive compsn. containing acrylonitrile/butadiene rubber, an epoxy resin, a phenol resin and an inorg. filler (aluminum hydroxide) as essential components is preliminarily applied to a metal foil. The compounding amt. of the inorg. filler is set to 60wt.% or less as a solid wt. basis. This metal foil is molded along with a prepreg under heating and pressure to produce a metal foil clad laminated sheet. In order to suppress the mutual blocking of the metal foils when the metal foils coated with the adhesive compsn. are superposed one upon another, 50 pts.wt. or less of modified silicone may be added to 100 pts.wt. of the adhesive compsn. when acrylic rubber is used in place of acrylonitrile/butadiene rubber, the discoloration of the laminated sheet due to heat is reduced.</p>
申请公布号 JPH06335992(A) 申请公布日期 1994.12.06
申请号 JP19940052400 申请日期 1994.03.24
申请人 SHIN KOBE ELECTRIC MACH CO LTD 发明人 SUGIURA SATOSHI;OTSUKA MINORU;SAKAGUCHI TATSU;KAMATA MITSUTOSHI
分类号 B32B7/02;B32B15/08;B32B38/00;H05K1/03;H05K3/02;H05K3/38;(IPC1-7):B32B15/08;B32B31/12 主分类号 B32B7/02
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