Method of packaging and assembling opto-electronic integrated circuits

摘要

A method of constructing opto-electronic integrated circuit packages passively aligns optical fibers inserted through holes in a package lid which are arranged in a pattern which corresponds with the pattern of emitters and receivers on a circuit die. When the lid is aligned with a package base to which the die is attached at a predetermined location, the fibers simultaneously couple to the emitters and receivers. The package components are each formed with alignment indicators. To assemble the packages, the alignment indicators are optically aligned to orient the components properly and the components are positioned such that centers of particular indicators are in predetermined positions relative to the centers other indicators. The components are then held in position while an affixation process secures them in place. Before the lid is secured to the base, a laser drills optic fiber holes to precise sizes in an array which corresponds with the locations of emitters and receivers on the die. The holes are sized differently for fibers associated with emitters and fibers associated with receivers. The fibers associated with emitters have core diameters which are a predetermined number of microns larger than the emitters, to compensate for beam divergence and package component alignment errors. The fibers associated with the receivers have core diameters which are a predetermined number of microns larger than optical waveguide taps on an associated circuit board.