| 摘要 |
<p>PURPOSE:To make it possible to conduct a highly reliable flip-chip connection which is strong for heat cycling test in the manufacture of a semiconductor device formed by flip-chip connecting a semiconductor chip and a mounting substrate. CONSTITUTION:For example, a bonding wire 13a is connected to the electrode pad 11a of a semiconductor chip 11 by a ball-bonding method. After the wire 13a has been cut into the prescribed length, a wire bump electrode 13 is formed by squeezing into a bump shape by compressing. By fusion-welding the wire bump electrode 13 and the substrate electrode 12a on a mounting substrate 12 using a low melting point metal 12b, the semiconductor chip 11 and the mounting substrate 12 are flip-chip connected.</p> |
