| 摘要 |
PURPOSE:To lessen the pitch of adjacent wiring patterns connected to the electrodes of a semiconductor element mounted on a wiring board and to miniaturize the mounting part of a semiconductor element. CONSTITUTION:A conductor layer 2 is formed on an insulating film 1 to form a wiring board 3 provided with a wiring pattern, and a bare IC chip 4 provided with electrodes 5 is directly mounted on the wiring board 3 and connected through such a method that through-holes 6 penetrating the conductor layer 2 and the insulating film 1 are provided to the wiring board 3 at the spots correspondent to the electrodes 5. The bare chip IC 4 is mounted on the rear of the wiring board 3 opposite to the conductor layer 2 making the electrodes 5 face the board 3, the electrodes 5 and the through-holes 6 are aligned with each other, and conductive member 7 is filled into the through-holes 6, whereby the conductor layer 2 and the electrodes 5 are electrically connected together. |
