| 摘要 |
PURPOSE:To dismount a defective chip smoothly from a multi-chip module without giving thermal damage to near non-defective chips. CONSTITUTION:Laser rays 11 emitted from a laser oscillator 5 are directed to the periphery of a defective chip 1 through optical fibers 6, made to impinge on a reflecting mirror 10 from a laser ray introducing path 9, bent by an angle of 90 degrees or so with the reflecting mirror 10, and made to irradiate a connecting bump 2 through a gap between the defective chip 1 and a circuit board 3 to melt it by heating. A suction chuck 7 where an exhausting suction hole 8 is provided is pressed against the rear of the defective chip 1 to chuck, and then the defective chip 1 is dismounted. |
