发明名称 METAL PACKAGE
摘要 <p>PURPOSE:To provide a metal package of a structure wherein the need for brazing between a cap and a wave absorber can be eliminated and a heat resistance adhesive and 'gold/gel' having poor wettability are not used. CONSTITUTION:In a metal package which is constituted by attaching a plate-like wave absorber 16 to a rear of a metallic cap 15 sealing an opening surface of a metallic bottomed case 10, at least one value of various values such as a lengthwise or crosswise length or a length of a diagonal line showing the size of a two-dimensional plane of the wave absorber 16 is set larger than a value of the same kind among various values showing the size of a two dimensional plane of an opening part.</p>
申请公布号 JPH06338696(A) 申请公布日期 1994.12.06
申请号 JP19930127639 申请日期 1993.05.31
申请人 SHINKO ELECTRIC IND CO LTD 发明人 MIYAMOTO TAKAHARU
分类号 H01L23/06;H05K9/00;(IPC1-7):H05K9/00 主分类号 H01L23/06
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