| 摘要 |
<p>PURPOSE:To provide a multilayer board for mounting a semiconductor in which the electric capacitance is decreased between a signal wiring and a power supply layer or a ground layer. CONSTITUTION:A ceramic multilayer board 11, for example, for mounting a semiconductor comprises a plurality of dielectric ceramic layers 14a-14e on which an inner signal wiring layer 17, a power supply layer 16, a ground layer 19, etc., are formed. The inner signal wiring layer 17 including a plated lead out wire is routed on more than one dielectric ceramic layer.</p> |
