摘要 |
PURPOSE: To provide functional modules comprising a three-dimensional multi- function processor system. CONSTITUTION: A silicon semiconductor carrier where active devices are embedded is used as a substrate 1, and multifunctional elements are mounted on both the sides of the substrate 1. Conductive vias 21, 21b, and 43 are provided to the semiconductor substrate 1 so as to interconnect single chips or multifunctional modules mounted on the semiconductor substrate 1 together. A wafer substrate is subjected to a boring/plating process, and devices which are electrically interconnected together are arranged on the side of the wafer substrate opposed to the substrate 1. A multi-chip module possessed of input/ output connection contacts corresponding to the vias 21, 21b, and 43 provided to the semiconductor substrate 1 and required functions is manufactured. The multi-chip module and the substrate 1 are interconnected together through a circuit composed of wirings and connection contacts formed on dielectric layers 4 and 53 possessed of the conductive bias 21, 21b, and 43, and the dielectric layers 4 and 53 are arranged on an active layer later. The dielectric layers 4 and 53 are extended outward from the module and electrically connected to other multi-function devices such as system devices and input/output devices. |