| 摘要 |
PURPOSE:To provide a multichip semiconductor device in which the mounting area is decreased, the heat dissipation performance is enhanced and reliability is enhanced in the connection with a mother board. CONSTITUTION:The multichip semiconductor comprises a metal board 1, a plurality of semiconductor chips 2 secured thereto, and a wiring board 3 disposed on the periphery of the semiconductor chip 2 while being connected electrically therewith. The wiring board 3 is provided with electrode pads 5f or allowing external connection in face down system. The semiconductor chip 2 is preferably sealed with a potting resin and covered with a protective cap. |
