| 摘要 |
PURPOSE: To provide a pre-treatment method and a device for pre-treating an electronic part manufacturing frame formed by press punching prior to chip bonding so as to prevent inner leads from being deformed. CONSTITUTION: Spheres such as glass beads which are 100μm or below, preferably 50μm or below in average grain diameter and comparably small in specific gravity are made to blow against the surface of a manufacturing frame together with an air flow of low pressure, high speed, and high flow rate.
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