| 摘要 |
<p>PURPOSE:To provide a package, for semiconductor-element housing, wherein it is possible to effectively prevent a large noise due to a fluctuation in a power- supply voltage from being generated, a semiconductor element housed at the inside can be operated normally and stably and the size of an insulating substrate can be reduced. CONSTITUTION:A package for semiconductor-element housing is provided with a quadrangular insulating substrate 1 in which many metallized pads 8 are applied and formed at prescribed intervals at the outer circumferential part on the main face and with many external lead terminals 7 which are bonded to the metallized pads 8 on the insulating substrate 1 via a brazing metal and which are connected electrically to individual power-supply electrodes and signal electrodes for a semiconductor element 3. Then, two metallized pads 8a, 8a, out of the metallized pads 8, which are adjacent so as to be separated by a corner part on the insulating substrate 1 come into electrical contact, and external lead terminals 7a, 7a which are connected electrically to the power-supply electrodes at the same potential out of the power-supply electrodes for the semiconductor element 3 are bonded to each other.</p> |
