| 摘要 |
PURPOSE:To provide a semiconductor mounting structure in which the positional shift of a semiconductor chip being mounted on a heat dissipation member can be prevented. CONSTITUTION:A protrusion 2b for positioning a semiconductor chip 3 with respect to a heat dissipation member 2 is provided on the chip mounting surface 2a of the heat dissipation member 2. Positional shift of the semiconductor chip 3 on the chip mounting surface 2a is prevented by means of the protrusion 2b. |
