| 摘要 |
PURPOSE:To provide the title paste for via-conductor capable of directly connecting to an Au conductor on the surface of a low temperature baking ceramic multilayer interconnection substrate as well as satisfactorily connecting to an inner layer wiring. CONSTITUTION:A laminated low temperature baking ceramic green sheet is baked at 850 deg.C using a low temperature baking conductor paste comprising 100wt.% of metallic component composed of 80-99wt.% of Ag and total 1-20wt.% of exceeding at least one kind out of Pd, Au, Pt blended with 0.3-7wt.% of crystallized glass and 8-50wt.% of organic vehicle for via and inner wiring. Accordingly, the ceramic green sheet can be used for via conductor as an outermost layer to be directly connected to the Au conductor on the surface thereby enabling a wiring pattern to be miniaturized. |
