摘要 |
PURPOSE:To provide a manufacturing method of a ceramic wiring board capable of making electrical connection of inner wiring conductor and surface wiring conductor sure. CONSTITUTION:The title method consists of the following; a process for preparing ceramic sintered body 1 having inner wiring conductor 2 from the inner part to the surface which conductor is composed of at least one kind of metal out of copper, silver, gold, and metal whose main componet is one of them, a process for flatly polishing the surface of the ceramic sintered body 1 by a mechanical polishing method, a process for sticking a metal-plated layer 4 on the exposed surface of the inner wiring layer 2 of the polished ceramic sintered body 1 so as to have a thickness wherein the metal-plated layer 4 protrudes from the ceramic sintered body 1 surface, a process for polishing and eliminating the protruding metal layer 4 as far as the same height as the ceramic sintered body 1 surface, by a mechanical polishing method and/or a chemical polishing method, and a process for forming surface wiring conductor 3 to be connected with the metal-plated layer 4 on the ceramic sintered body 1 surface by thin film technique. |