| 摘要 |
<p>PURPOSE:To provide a wiring board wherein the disconnection of a metallized wiring layer applied to an insulating substrate composed of a glass ceramic sintered body is eliminated, the metallized wiring layer can be attached firmly to an external lead terminal and the propagation speed of an electric signal transmitted in the metallized layer can be made high and to provide its manufacturing method. CONSTITUTION:In a wiring board, external lead terminals 3 are attached, via a brazing material 5, to a metallized wiring layer 2 which has been applied to an insulating substrate 1 composed of a glass ceramic sintered body. In the wiring board, the external lead terminals 3 are at a Vickers hardness (Hv) of 100<=Hv<=150, and the melting temperature of the brazing material 5 a is at 600 deg.C or lower.</p> |
