| 摘要 |
<p>PURPOSE:To manufacture a multilayered wiring board in a short time, with high yield and a small number of processes, by a method wherein fluid polymer precursor containing no solvent is cured by applying hydrostatic pressure, and an insulating film is formed. CONSTITUTION:A metal mold 104 is arranged on the wiring layer side of a base board 100 having at least either one of horizontal wiring conductor 101 and vertical viaconductor 102, and fluid polymer precursor containing no solvent is supplied between the base board 100 and the metal mold 104. After gas in a gap 105 is exhausted from a vent 106, the metal mold is moved toward the base board 100 direction, and the adjacent conductor gap on the base board 100 is filled with the fluid polymer precursor 103. By curing it under hydrostatic pressure, an insulating film 107 is formed. After the upper surface of the vertical viaconductor 102 is exposed, a wiring layer composed of the following is formed; at least either one of other horizontal wiring conductor 108 and vertical viaconductor 109 which are connected with the horizontal wiring conductor 101 or the vertical viaconductor 102.</p> |
