METHOD FOR FORMING THREE-DIMENSIONAL CIRCUIT

摘要

PURPOSE:To provide a method for forming a three-dimensional circuit which can manufacture it simply in a short time with a reduced manufacturing process and has a low manufacturing cost. CONSTITUTION:(a) Firstly, an injection molded product 1 is constituted from a resin in a desired shape. (b) A surface treatment such as catalyst application is made so that electroless plating of sufficient adhesion strength may be conducted. (c) The whole is coated with a resist 2. (c) A desired pattern is irradiated with a laser beam such as YAG laser to pattern the resist 2. (e) Electroless plating 3 such as of copper is made to form a conductor pattern. (f) If necessary, the resist 2 is removed at the end.