COOLING MECHANISM FOR ELECTRONIC EQUIPMENT

摘要

PURPOSE:To efficiently cool down the title electronic equipment while minimizing the thermal effect on the other parts by a method wherein the rear surface of plural high heating parts is coupled with a miniaturized heat sink having numerous fins or similar to a printed wiring board through the intermediary of plural thermal conductors formed of a high heating conductive member. CONSTITUTION:The printed wiring boards 34 loaded with plural low heating chips 31 and plural high heating chips 33 are fitted to a shelf 35 at specific intervals. Next, screws 16 are provided on the rear surface of respective high heating chips 33 so that one ends of plural thermal conductors 11 formed of a high heating conductive member may be fixed on the rear surface of respective high heating chips 33 using the screw parts 16. On the other hand, the other ends of respective thermal conductors 11 are coupled with a heat sink base plate 13 having numerous fins 12 using a fixing screw 17. In such a structure, in order to make effective use of the limited space, the other ends of respective thermal conductors 11 are to be fixed to the fin side of the heat sink base plate 13 thereby enabling the fins 12 to be widened by the thickness of the thermal conductors 11.