| 摘要 |
PURPOSE: To connect stably first and second metal wirings on thin dielectric substrates with each other without needing a special aligning device by a method, wherein the second metal wirings provided on the other dialectic substrate are fitted into grooves, formed in the dielectric substrate on one side of the dielectric substrates and both metal wirings are pressure bonded. CONSTITUTION: In a substrate 1 on one side of substrates 1 and 2, metal wirings 12 are wired on a dielectric substrate 13, and grooves 14 are formed in the surface on a side opposite to the surface, which is provided with the wirings 12 of the substrate 13. These grooves 14 are formed in parallel to each other along the wirings 12 and the tops 15 of the grooves 14 come into contact with the wirings 12. That is, the grooves 14 penetrate in the thickness direction of the substrate 13. The other substrate 2 consists of a dielectric substrate 23 and metallic wirings 22 provided on the surface of the substrate 23. At the time of the connection of the substrate 13 with the substrate 23, the wirings 22 provided on the substrate 23 are fitted into the grooves 14, provided in the substrate 13 and the wirings 12 and 22 are electrically connected with each other. In this case, it is preferable that the wirings 12 are brought into contact with the wirings 22 via a low-melting point metal, such as a solder. |
