DICING ADHESIVE SHEET AND DICING METHOD

摘要

PURPOSE:To solve a problem caused by the wrinkle and elongation of adhesive sheet stuck to a material to be cut at the time of cutting the material to be cut such as silicon wafer into chips by means of a dicing apparatus. CONSTITUTION:After a dicing adhesive sheet 1 formed by the application of adhesive to a base-material sheet composed of filmy heat-shrinkable organic material with 1-20% heat shrinkage factor is stuck to a material to be cut 2, the adhesive sheet is heated and shrunk so that the wrinkle and elongation of the adhesive sheet are removed. Thus, it is possible to prevent inconveniences such as scattering of small cut pieces to perform accurate and efficient cutting.