| 发明名称 |
SURFACE MOUNTING COMPONENT AND MOUNTING BOARD |
| 摘要 |
<p>PURPOSE:To ensure sufficiently high solder bonding strength without requiring any manual soldering for reinforcement even if a lead is connected to a land on a board using a solder containing bismuth by 8% in order to prevent removal of a surface mounting connector from the board due to external force during use. CONSTITUTION:A palladium based plating layer 11 and a gold plating layer 12 are formed sequentially on the surface of reinforcing lead 3 of a connector 10 and the lead 3 is connected with a land 9 on a board 8 using a solder 21 containing bismuth by 8%.</p> |
| 申请公布号 |
JPH06334088(A) |
申请公布日期 |
1994.12.02 |
| 申请号 |
JP19930123789 |
申请日期 |
1993.05.26 |
| 申请人 |
FUJI PHOTO FILM CO LTD |
发明人 |
TAKIGAMI KOTARO |
| 分类号 |
B23K35/26;H01L23/50;H05K1/18;H05K3/34;(IPC1-7):H01L23/50 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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