| 摘要 |
<p>PURPOSE:To provide the title multilayer interconnection substrate capable of setting up and controlling the characteristics impedance of a signal wiring layer as well as composing at low cost. CONSTITUTION:The title multilayered wiring substrate is provided with a ceramic laminated layer wiring parts 3 comprising a laminated layer 3a, a power supply wiring layer 3b and a signal wiring layer 3c as well as a thin film wiring layer 4 comprising plural signal wiring layers 4a including a gland wiring layer 4b integrally formed on said ceramic laminated layer wiring parts 3. In such a constitution, said multilayer interconnection wiring substrate is composed of the gland wiring layer 4b of the thin film wiring part 4 to be positioned on the upper layer than the topmost signal wiring layer 4a' as well as said plural signal wiring layers 4a, 4a' laminatedly arranged between the grand wiring layers 4b of the ceramic laminated layer wiring part 4.</p> |
