| 摘要 |
PURPOSE:To obtain the resist ink composition functioning as a solder resist film superior in a water-soluble flux resistance and high in reliability by using an unsaturated compound obtained by reaction between an epoxy compound having a naphthalene skeleton and an unsaturated monobasic acid. CONSTITUTION:This resist ink composition contains (A) the unsaturated compound obtained by reaction between the 1, 6-diglyidyl-oxynaphthalene and the unsaturated monobasic acid, (B) an active light setting resin obtained by reaction between the reaction product (of an epoxy compound with an unsaturated monobasic acid) and a saturated or unsaturated polybasic acid, (C) a photopolymerization initiator, and (D) an epoxy compound having >=2 epoxy groups in one molecule in a mixing weight ratio A/B of 5-30:95-70 and in that C/(A+B) of (2-30):100 and in that D/B of (10-50)/100, thus permitting this composition to be improved in photosensitivity and easily photo setting in a short exposure time and easily developed with a weak alkali aqueous solution. |
