发明名称 MANUFACTURE OF MULTILAYERED BOARD
摘要 PURPOSE:To restrain deviation of inner layer members or the like in a lamination bonding process by a maslamination method, and enable coping with the change of thickness of the whole laminate on account of the change of board thickness or lamination condition, by employing one kind of shift-preventing metal plate. CONSTITUTION:In a lamination bonding process by the maslamination method of a multilayered board, an expansion structure 13 is employed for the shift- preventing clamp of a shift-preventing metal plate 1 which prevents the shift of inner layer plates 6 or metal plates 5a, 5b, and a laminate is formed by heating and pressing. The expansion structure 13 expands when pressure is not applied from a lamination press heating platen 3 or the like, and contracts when the pressure is applied.
申请公布号 JPH06334342(A) 申请公布日期 1994.12.02
申请号 JP19930139910 申请日期 1993.05.20
申请人 HITACHI TELECOM TECHNOL LTD 发明人 ITO JUNICHI;OTAKE HAJIME
分类号 B29C65/02;B29L31/34;H05K3/46;(IPC1-7):H05K3/46 主分类号 B29C65/02
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