发明名称 CARD TYPE PACKAGE
摘要 <p>PURPOSE:To enable the sufficient heat radiating effect to be given to the title card type package even if elements in high heat generation are packaged. CONSTITUTION:The title card type package is provided with a substrate 2 for mounting a frame 1, elements 3a, 3b, and a connector 4 as well as reinforcement plates 5a, 5b capable of fitting a substrate 2 to the frame 1 as if holding both surface and rear surface sides of the substrate 2. The frame 1 comprising a metallic material is composed of a side frame 10 and inner beams 13, 14 bridging over the side frame 10. On the other hand, contact surfaces 13a, 14a coming into contact with the elements 3a, 3b to be mounted on the substrate 2 are formed on the specific positions on the inner beams 13, 14.</p>
申请公布号 JPH06334357(A) 申请公布日期 1994.12.02
申请号 JP19930116891 申请日期 1993.05.19
申请人 JAPAN AVIATION ELECTRON IND LTD 发明人 SUZUKI KEIICHIRO
分类号 B42D15/10;G06K19/077;H01R4/00;H05K5/00;H05K7/14;H05K7/20;(IPC1-7):H05K5/00 主分类号 B42D15/10
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