| 摘要 |
<p>PURPOSE:To form a wire bonding terminal which causes no problem of insufficient insulation even if the number of wire bonding pads is increased due to high integration of IC or LSIC. CONSTITUTION:An outer layer (or layers) 6 or outer layers 6 is laminated on one or both side of an inner layer 3, comprising a board 1 and conductor patterns 2 formed on the surfaces thereof, using a copper clad insulation sheet having an insulation layer soluble to an alkaline aqueous solution. A predetermined part of an outer layer copper toil 5 is removed by etching and an exposed insulation layer 4 is dissolved into the alkaline aqueous solution and removed thus exposing the board 1 and a wire bonding terminal 10 at a position for mounting an LSI or the like. Furthermore, a wire bonding terminal 12 and a conductor pattern are formed on the laminated copper foil 5 thus forming the wire bonding terminals 10, 12 in two stages of inner and outer layers 3, 6.</p> |
