| 摘要 |
PURPOSE:To prevent the sagging of bonding wires electrically connecting the pads of electronic components with pads arranged in zigzag with a simple constitution. CONSTITUTION:Pads 4 to be connected electrically to an IC chip 5 by wiring bonding are arranged in zigzag around an electronic components mounting section 3 and the lengths of the inside pads 4a closer to the section 3 are made longer than those of the outside pads 4b farther from the section 3. When such a constitution is used, the outside pads 4b can be brought nearer to the section 3. Therefore, the lengths and weights of the bonding wires 6 connected to the pads 4b are reduced and the sagging of the wires 6 can be prevented with such a simple constitution without using any special members. |
