发明名称 PREPARATION OF MULTILAYER THICK FILM CIRCUIT WITH RESISTANCE EMBEDDED
摘要 <p>PURPOSE:To stably form resistors having a less error in resistance by subjecting printed first layer conductors and resistors to firing at a first firing temperature, and exposing subsequently printed insulators and second layer conductors to firing at a second temperature lower than that of the first firing. CONSTITUTION:A material having a relatively high firing temperature (e.g. 850 deg.C), is used for first layer resistors 14. The material is fired and trimmed as required to adjust its resistance. Since the resistors 14 are thereafter subjected only to heat at relatively low temperature (600 deg.C or below), their resistance hardly varies from that immediately after the firing of the resistors or the adjustment of their resistance by trimming. Therefore, the resistors maintains characteristics inherent in their material, and a resistance as designed with accuracy. This makes it possible to form a mutilayer thick film circuit including embedded resistors having a resistance with accuracy.</p>
申请公布号 JPH06334295(A) 申请公布日期 1994.12.02
申请号 JP19930125626 申请日期 1993.05.27
申请人 MITSUBISHI MATERIALS CORP 发明人 NAKAMURA MASAHIKO
分类号 H01C7/00;H01C17/06;H01L23/12;H01L27/01;H05K1/16;H05K3/46;(IPC1-7):H05K1/16 主分类号 H01C7/00
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