发明名称 PRINTED BOARD DESIGN ASSEMBLY EQUIPMENT
摘要 PURPOSE:To set a design position as a proper position and to conduct excellently a mounting of a component by a method wherein the positions of support instruments are ensured and are designed from the design stage of a printed board and the support instruments are automatically installed utilizing data on the positions. CONSTITUTION:A printed board design assembly equipment is provided with a printed board design equipment 2 for designing a printed board, support instruments 39a, 39b, 39c, 39d and 39e for supporting the printed board from the lower side of the printed board, a component mounting equipment 9 for automatically mounting a component on the printed board and a data preparing equipment 3 for actuating the equipment 9 utilizing data on the equipment 2. In the printed board design assembly equipment, the positions of the instruments 39a, 39b, 39c, 39d and 39e are respectively set at prescribed positions by the equipment 2 and a component arrangement design is made. Data on the positions is sampled by the equipment 3, NC data for packaging machine is generated and the support instruments are automatically installed by a controller 4.
申请公布号 JPH06334386(A) 申请公布日期 1994.12.02
申请号 JP19930118658 申请日期 1993.05.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 NAKAMURA SHIGEKI;HARA TETSUYA;TSUCHIYA MICHIE
分类号 B23P21/00;H05K13/00 主分类号 B23P21/00
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