摘要 |
A three dimensional chip package comprising a plurality of semiconductor substrates (101-107), each having at least one semiconductor electronic device (150, 151) mounted thereon; means (135, 136) for physically joining at least a subset of said plurality substrates to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and means (175, 176) for providing cooling channels (190, 191) within said enclosure into which a cooling fluid may be introduced. |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US |
发明人 |
BREGMAN, MARK FIELDING, RIDGEFIELD, CONNECTICUT 06877, US;HORTON, RAYMOND ROBERT, DOVER PLAINS, NEW YORK 12522, US;NOYAN, ISMAIL CEVDET, PEEKSKILL, NEW YORK 10566, US;PALMER, MICHAEL JON, WALDEN, NEW YORK 12586, US |