| 摘要 |
The present invention prevents poor connection due to deformation of an IC chip in connection bodies in which the IC chip or another electronic component is in an anisotropically electroconductive connection with a substrate. The present invention is provided with: an electronic component 18 provided with a first bump row 24 in which bumps 23 are arranged along one side edge, and a second bump row 26 in which bumps 25 are arranged along the other side edge, which faces the one side edge; and a substrate 12 having a first terminal row 20 in which electrode terminals 19 that are connected to the bumps 23 arranged in the first bump row 24 are arranged, a second terminal row 22 in which electrode terminals 21 that are connected to the bumps 25 arranged in the second bump row 26 are arranged, and protrusions 40 that are provided between the first terminal row 20 and the second terminal row 22, said protrusions 40 supporting an inter-bump-row region 30 between the first bump row 24 and the second bump row 26. The electronic component 18 is compression bonded to the substrate 12 with an adhesive 1 interposed therebetween. |
