发明名称 Verwendung von Copolyamiden zum Heißsiegeln
摘要 the invention relates to the use of copolyamides as hot-melt adhesives for heat-sealing, where at least 3 monomer components selected from the following group are copolymerised in the copolyamide: an equimolar mixture of adipic acid and hexamethylenediamine (6,6-salt), laurolactam, 11-aminoundecanoic acid, an equimolar mixture of azelaic acid and hexamethylenediamine (6,9-salt), an equimolar mixture of sebacic acid and hexamethylenediamine (6,10-salt) and an equimolar mixture of dodecanedioic acid and hexamethylenediamine (6,12-salt), where the melting point of the copolyamide is below 140@C, and at least 10 % by weight of laurolactam and/or 11-aminoundecanoic acid are copolymerised.
申请公布号 DE4318047(A1) 申请公布日期 1994.12.01
申请号 DE19934318047 申请日期 1993.05.29
申请人 ELF ATOCHEM DEUTSCHLAND GMBH, 40474 DUESSELDORF, DE 发明人 JONG, EDUARD DE, 5210 TROISDORF, DE;HAPELT, KARL-HEINZ, 5300 BONN, DE
分类号 C09J177/00;C08G69/36;C09J177/02;C09J177/06 主分类号 C09J177/00
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