METHOD AND EQUIPMENT FOR INSPECTING APPEARANCE OF BUMP

摘要

PURPOSE:To extract the feature of defect while allowing the various influence from the surface conditions of a bump within some range. CONSTITUTION:A mechanism control section 12 shifts a stage 11 mounting a wafer 3 such that a bump 1 formed on a chip 2 is located immediately below the optical axis 5 of a CCD 10. An image processing section 15 sets a reference window surrounding each bump 1 for an image picked up by means of the CCD 10. Furthermore, the reference window is reset to be enlarged or subdivided into small windows in order to optimize the extraction of feature amount for each defect and then the feature amount is detected for each defect based on the image information in the reset window. A CPU 14 subjects the feature amount extracted at the image processing section 15 to statistic processing thus calculating an evaluation value being employed in the detection of defective bump. Subsequently, the mechanism control section 12 shifts the stage 11.