| 摘要 |
PURPOSE:To provide the miniaturized thin type and low cost chip part type light emitting diode capable of directly packaging on the surface of wiring substrate not through the intermediary of a bonding wire. CONSTITUTION:Within the chip part type light emitting diode, the P and N type electrode 3, 4 provided on both ends of opposing chips in parallel with the P-N junction surface of a P type layer 1 and an N type layer 2 are respectively provided with solder coating layers 5, 6 on the surfaces thereof while the sides excluding both ends of the chips are provided with insulating resin coating layers on the surfaces thereof. |
