| 摘要 |
PURPOSE:To change the temperature of a bonding tool by using a continuous heating system in the structure of the bonding tool used for connecting a glass substrate and a tape substrate. CONSTITUTION:The structure of a bonding tool consists of a pressure body 2 with a pressure surface 7, a pressure-body moving mechanism 4, a heating element 1 with a heat generating section and a heating-element moving mechanism 3. Through-holes 1 for cooling are formed to the pressure body 2, and the pressure body 2 is heated by a contact with the heating element 1. The heating element 1 is separated, and a refrigerant is flowed into the through-holes 11, thus allowing the cooling of the pressure body 2. |
